Assmann WSW

*Chip-1 Exchange only distributes ASSMANN WSW in North America and South America.

The industrial activities and company history of the ASSMANN family was started in the 18th century. ASSMANN & Söhne did produce at that time metal buttons for the clothing industry and as well medal decorations for the military. Later on in the 20th century ASSMANN & Söhne became famous for being one of the pioneers for heat sink technology. ASSMANN & Söhne and another company named ASSMANN KG was established in 1969. Dieter Assmann started this company and his activities focused on the development and production of IC sockets and IDC connectors for flat cable applications. In the 80's Dieter Assmann combined and controlled both product groups, the heat sink and the connectors, in the company ASSMANN GmbH, which became later the ASSMANN Electronic GmbH. During these times, another product segment was developed, computer and network peripherals. This business realized tremendous growth under the leadership of the sons. Today the company, Assmann WSW focuses on a number of connector solutions covering almost every application in the electronics industry.

Assmann WSW components quality

Continuous quality control and following the Zero Defect Strategy the ASSMANN WSW components group has been set as main target. Qualifications according to DIN ISO 9001:2008 and DIN ISO 14001:2005 have been first important steps on this path. Prerequisite is to work only with certified and / or audited partners. To reach the qualification according to QS 9000 and ISO TS 16949 for the manufacturing plants is another target. At ASSMANN WSW components QUALITY is written in BIG letters.

Applications:

  • Telecom/Server
  • PC/Notebook
  • LAN
  • USB
  • SD Card
  • Automotive
  • HDTV
  • STB
  • Handheld Devices
  • computing
  • Almost any type of electronic device

Product offerings:

  • Connectors
  • Heat Sinks
  • Cables (USB/Ethernet)
  • Waterproof Products
  • Toolless Modular Keystones


Homepage: www.assmann.us

Press Release: read more...